When you solder manually you usually hold the part using tweezers; during wave soldering part is held by the glue, and if you place via under the pad which will be soldered, hot air in the via will extend under the temperature during soldering, and this air pressure may potentially break the glue and make component “stand-up” on the board. Here’s the illustration (however for different cause), scroll to the bottom of page.
When you hold part manually, probability of this effect is minimal, plus you will see it immediately and will rework the soldering
The point is that you have 3V3D adjacent to 3V3A , would be better to separate them with space at ground level so that the only location they are nearby is the ferrite bead.
If you talk about R19, just re-orient it vertically so that power does not run near the differential signal. Remember you can place components any way you think will be best for EMI, not forgetting about ensuring that parts remain hand-solderable.